Precision die cutting technology shapes the future

Primarily used in smartphones, tablets, automotive displays, wearable devices, and related products.
Used to protect glass or touch panels (RTP/CTP) from display panels (FTF LCM/OLED), providing a tight bond with high optical transmittance, strong adhesion, and easy application.

Primarily used in consumer electronics, e-paper readers, industrial control panels, optical instrument lenses, and other related products.

Applications in the optical display industry include anti-glare, anti-reflection, and water penetration prevention. Materials are precision-processed, slitting, laminating, and die-cutting according to customer specifications.

Mainly used in semiconductor packaging, consumer electronics, smartphones, tablets, and related products.

Precision stamping is available in sheet and strip reel winding to meet customer design requirements and bonding equipment types.

Primarily used in wafer semiconductor manufacturing, optical panel manufacturing, and consumer electronics casing and body protection, etc.

Special materials are developed according to customer specifications and based on material properties, including processing methods and special die-cutting structures.