PSA/EMI tape
Our products are primarily used in core components for semiconductor packaging, consumer electronics, smartphones, and tablets. To perfectly align with the diverse automated bonding equipment used by major global manufacturers, we offer highly flexible customized delivery specifications. Our precision die-cutting process can be tailored to customer design requirements, providing high-precision "sheet" shipments or high-efficiency "reels/rolls" packaging, significantly enhancing the automated assembly efficiency of our clients' production lines.
Types and packaging of die-cut products
Types of die-cut products
Multi-functional automated packaging specifications
Quality Inspection and Intelligent Manufacturing Instructions
Automated Optical Inspection: Full Inspection and High-Precision Process
Within the cleanroom environment, industry-leading testing and automated die-cutting technologies are employed for high-specification tapes and EMI electromagnetic shielding materials to effectively ensure quality.
Automated Optical Inspection
To meet the stringent requirements of high-precision semiconductor packaging and consumer electronics, our continuous roll production line is equipped with high-resolution AOI (Automated Optical Inspection) equipment, providing a one-stop solution for automation equipment. The system can scan for product defects around the clock and automatically, performing precise dimensional measurements and multi-faceted full inspection, preventing defective products from flowing into downstream production lines.
Advanced process and process optimization design
We possess superior Progressive Die Cut Process technology, enabling high-precision alignment and composite die cutting for complex, multi-layered products with multiple strokes. We can flexibly choose between roll or sheet delivery based on customer needs. We have extensive experience in automated process design, helping customers simplify die-cutting steps to achieve accurate, fast, and high-yield continuous production specifications.
Assess your tape and electromagnetic shielding material processing needs
Whether it's semiconductor packaging tape, EMI electromagnetic shielding materials, foam tape die-cutting, or customized multi-layer structure cutting, we welcome your exclusive technical consultation and sample quotation.
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