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Optical adhesive

Optical adhesive

Primarily used in smartphones, tablets, automotive displays, wearable devices, and related products.
Used to protect glass or touch panels (RTP/CTP) from display panels (FTF LCM/OLED), providing a tight bond with high optical transmittance, strong adhesion, and easy application.
DETAIL
// OPTICAL CLEAR ADHESIVE

Optical adhesives
Precision
die-cutting components

Advanced optical adhesives are primarily used in high-precision technological components such as smartphones, tablets, automotive displays, and wearable devices. This core material is specifically designed for the tight bonding between protective glass or touch panels (RTP/CTP) and display panels (TFT LCM/OLED). In terms of optical performance, it exhibits excellent high transmittance, high adhesion, and easy-to-attach close bonding effect, making it an indispensable functional material for advanced bonding processes.

高精度OCA光學膠模切裁切組件
// DESIGN & SPECIFICATIONS

Structure and specifications of die-cut finished products

 


Die-cut finished product structure

1. 3-layer structure sensor positioning

2. 4-layer structure edge positioning

3. Customized special structure methods

 

Die cutting and specification verification

Thickness range:With an wide range of thickness options from 10um to 500um, it fully meets the customized explosion-proof and bonding needs of high-end to miniaturized products.
Maximum width of die-cutting:500mm x 800mm, high-precision large-area die-cutting ensures high-quality shipment of large-size automotive panels.
// ADVANCED DEVELOPMENT

New product customization development capability

We conduct customized development based on customers' high-end technical drawings or the physical properties of new materials. Currently, we have completed the following process deployments for mainstream and special adhesive systems:

1. UV Type Adhesive-Based OCA Die-Cutting

For highly sensitive optical materials, our die-cutting environment utilizes photolithography processes that comply with international semiconductor and optoelectronic packaging standards throughout the entire production process, and incorporates high-protection, UV-resistant packaging materials. Our standardized UV-adhesive die-cutting process has obtained certification and stable supply from leading international listed companies.

2. Irregular outline cutting of optical adhesive

Equipped with a high-precision flat-plate punching machine and rotary precision equipment, it is specially designed to solve the needs of panel hole punching, special curved surfaces or asymmetrical geometric shapes, ensuring no glue overflow at the edges and no stringing, perfectly matching the perfect outline and structural designs.

Assess your optical adhesive processing needs

Whether you have needs for optical adhesive bonding and die-cutting for smart devices, large automotive panels, or wearable components, please contact for immediate technical consultation and sample quotation.

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